| On this page:
News,
Current Issues
Webcasts,
White Papers,
Events,
From the Wires,
QuickVote
|
2008 Advanced Packaging Awards |  | |
|
EV Group Reports Continued Growth
(November 20, 2008) ST. FLORIAN, Austria,— Crediting the continued demand in the 3D interconnect interconnect/through-silicon via (TSV) an nanoimprint lithography markets, EV Group reports an increase in revenue for 2008 of more than 15%. Despite the current global economic slowdown, the company says it remains cautiously optimistic about its outlook for 2009 given the expected growth opportunities to ensue as these novel technologies gain market acceptance/penetration.
electronica 2008 Highlights
(November 20, 2008) MUNICH, Germany — electronica 2008 attendance was stable this year despite the difficult financial situation facing many exhibitors and attendees, reported event coordinators Messe München International (MMI). Of the 2,800 exhibitors, 58% were international. Around 72,000 people attended.
|
|
|
Current Issues, Newsletters and Resource Guides | | |
|
|
From The Wires | | |
|
|
From the Editor
A Difference of Perspective
It's interesting that in the space of half an hour at the same symposium — IMAPS International 2008 — I could experience such vastly different answers to the same question. ...
|
|
Photonic Interconnects Enable the Continuation of Moore's Law
By Françoise von Trapp, managing editor
It's common knowledge that Moore's Law, as we know it, has reached a point where it can no longer follow its normal progression of doubling the number of transistors ...
|
MEPTEC Symposium: Density and Cost is Driving Innovation
by Julia Goldstein, Ph.D. contributing editor
Speakers at MEPTEC's Packaging Developments and Innovations Symposium, November 13, 2008 in San Jose, CA, presented various new technologies to enable package ...
|
|
Advisory Board
Energy and Advanced Packaging
By R. Wayne Johnson, Ph.D., Auburn University
While $4/gal.gasoline prices have dropped, it is inevitable they will rise again. So what does this have to do with ...
|
IMAPS International 2008 In Review
By Gail Flower, Editor-in-Chief
This year's IMAPS International Symposium had great international participation, good attendance and excellent presentations from keynoters to the technologically cutting-edge ...
|
|
The Riley Report
The 3D Marathon Continues
by George A. Riley, Ph.D. contributing editor
3D packaging research papers drew crowds at the Advanced Technologies sessions of this month's IMAPS 2008 International Symposium. ...
|
Gartner Forecasts SATS Market Decline
(November 18, 2008) STAMFORD, CT — Following 3Q earnings reports of companies in the semiconductor assembly and test services (SATS) industry, Jim Walker, analyst, Gartner, reports yet another decline in ...
|
|
IMEC and Panasonic Join Forces for CMOS Research
(November 14, 2008)OSAKA, Japan and LEUVEN, Belgium — IMEC and Panasonic Corporation have signed a joint research contract that will focus on advanced technologies in the semiconductor, networks, wireless, ...
|
|
Webcasts | |
|
|
Sponsored White Papers Library | | |
|
|
|
| |
|
|
QuickVote | |
Should the back-end-of-the-line be re-named middle-of-the-line?
|
|
|
|
Upcoming Events | | |
|
|
Web Exclusives 
